G.Skill Launches High-Performance DDR5 Memory: CL30 at 6400 MT/s

On Tuesday, G.Skill unveiled its impressive DDR5-6400 memory modules, known for their ultra-low-latency of just 30 clock cycles. This marks one of the boldest timings we’ve seen so far for DDR5-6400 sticks. These modules are compatible with both AMD and Intel-based systems, expanding their appeal to a wide range of users.

Each new generation of DDR memory pushes the envelope with faster data transfer rates, though it often comes with extended relative latencies. For most scenarios, the higher bandwidth compensates for the latency, but some applications prefer shorter latencies. Reducing these latencies is certainly harder than boosting transfer speeds, making low-latency modules a rare find in the market.

Against these odds, G.Skill has succeeded in sourcing the best DDR5 memory chips and designing suitable printed circuit boards to create DDR5-6400 modules with a remarkable CAS latency of 30. This is a significant improvement over the CL46 timings that JEDEC recommends for this category. To put this into perspective, while standard JEDEC modules have an absolute latency of 14.375 nanoseconds, G.Skill’s modules manage to cut that down to just 9.375 nanoseconds—a reduction of about 35%.

The DDR5-6400 CL30 39-39-102 modules from G.Skill come in a 16 GB capacity and can be purchased in 32 GB dual-channel kits. Although the company hasn’t revealed the voltage levels, they are anticipated to be much higher than JEDEC norms.

G.Skill has designed its DDR5-6400 modules to integrate seamlessly with AMD’s EXPO profiles (under Trident Z5 Neo RGB and Trident Z5 Royal Neo) and Intel’s XMP 3.0 profiles (within Trident Z5 RGB and Trident Z5 Royal). For systems like AMD’s AM5 that have an effective limit of 6000 MT/s to 6400 MT/s for DDR5 memory—matching the peak speed of AMD’s Infinity Fabric at a 1:1 ratio—these new modules present a significant advantage, especially for the Ryzen 7000 and 9000 series processors.

However, G.Skill warns that these specialized modules are not universally compatible. They require high-end motherboards with adequate CPU cooling for optimal performance.

The global release for these high-performance memory kits is scheduled for late August 2024 through G.Skill’s partners. Pricing details are under wraps for now, but given their exclusive features, they’re expected to come with a premium price tag.